2023 3rd International Symposium on Mechanical Systems and Electronic Engineering (ISMSEE 2023)
All papers will be reviewed by two or three expert reviewers from the conference committees. After a careful reviewing process, all accepted papers will be published in the Conference Proceedings, and submitted to EI Compendex, Scopus for indexing.
Important information
Conference Dates:July 28 to 30, 2023
Conference Venue: Dali· China
Full Paper Submission Date: February 28,2023
Notification of Acceptance Date: Within one week of submission
Index：EI-Compendex、Scopus
About ISMSEE 2023
2023 3rd International Symposium on Mechanical Systems and Electronic Engineering (ISMSEE 2023) will be held in Dali from July 28 to 30, 2023. The conference will focus on topics such as "mechanical system dynamics", "mechanical transmission and system measurement and control", "telecommunication engineering" and "computational engineering", aiming to provide a platform for scientific research scholars, technicians and related personnel engaged in mechanical system and electronic engineering to share scientific research achievements and cutting-edge technologies, understand academic development trends, broaden research ideas, strengthen academic research and discussion, and promote industrial cooperation of academic achievements. Experts, scholars, business people and other relevant personnel from universities and research institutions at home and abroad are cordially invited to attend and exchange.
Committee
Program Committees
Assoc. Prof. Wei Jiang
Huazhong University of Science and Technology, China
Assoc Prof. Wei Jiang
Huazhong University of Science & Technology, China
Prof. Pramod Kumar Singhal
Department of Electronics, Madhav Institute of Technology & Science, Gwalior, India
Prof. Jiang Zhu
Department of Mechanical Engineering, Tokyo Institute of Technology, Japan
Prof. Anil L. Wanare
JSPM’s BSIOTR, Wagholi, India
Keynote Speakers
Prof. Hong Huang
Chongqing University
Experience:
Prof. Huang Hong,doctoral supervisor, director of the Department of Measurement and Control Technology and Instrument of Chongqing University, head of the Image Information Processing Research Office, national first-class undergraduate major, and the characteristic major of "big data intelligence" in Chongqing. He is a member of the Organizing Committee of the China EU "Dragon Plan", an expert in the evaluation of the Ministry of Science and Technology, an expert in the evaluation of the Degree Center of the Ministry of Education, a special expert in civil air defense in Chongqing, a guest editor in chief of Frontier in Oncology, and a guest editor of Applied Sciences.
Mainly engaged in image processing and pattern classification, target detection and recognition research, and relevant achievements have been applied in remote sensing observation, medical diagnosis, process industry and other fields. In recent years, he has presided over three national natural science projects, national key research and development projects, major consulting projects of the Chinese Academy of Engineering, special projects for common key technology innovation in Chongqing's key industries and other scientific and technological projects. As the first/corresponding author in IEEE TNNLS, IEEE Trans More than 50 SCI academic papers have been published in international well-known academic journals such as Cybernetics, Pattern Recognition, etc. Google has cited more than 2000 times in total, of which 3 were selected as high cited papers of ESI. He has won the second prize of China Machinery Industry Science and Technology Progress Award, Huawei Scholarship, Chongqing Excellent Doctoral Thesis Instructor, the most popular teacher of Chongqing University and other honors, and guided students to win the second place in the medical and health track of the "2020 SEED Big Data Development and Application Competition" (650 teams).
Professor Dr. Subhas Mukhopadhyay，FIEEE (USA), FIET (UK), FIETE (India)
Distinguished Lecturer – IEEE Sensors Council
School of Engineering, Macquarie University, NSW 2109
Experience:
Subhas holds a B.E.E. (gold medallist), M.E.E., Ph.D. (India) and Doctor of Engineering (Japan). He has over 31 years of teaching, industrial and research experience.
Currently he is working as a Professor of Mechanical/Electronics Engineering, Macquarie University, Australia and is the Discipline Leader of the Mechatronics Engineering Degree Programme. His fields of interest include Smart Sensors and sensing technology, instrumentation techniques, wireless sensors and network (WSN), Internet of Things (IoT), Mechatronics etc. He has supervised over 45 postgraduate students and over 150 Honours students. He has examined over 75 postgraduate theses.
He has published over 450 papers in different international journals and conference proceedings, written ten books and fifty two book chapters and edited eighteen conference proceedings. He has also edited thirty five books with Springer-Verlag and thirty two journal special issues. He has organized over 20 international conferences as either General Chairs/co-chairs or Technical Programme Chair. He has delivered 402 presentations including keynote, invited, tutorial and special lectures.
He is a Fellow of IEEE (USA), a Fellow of IET (UK), a Fellow of IETE (India). He is a Topical Editor of IEEE Sensors journal. He is also an associate editor of IEEE Transactions on Instrumentation and Measurements and IEEE Reviews in Biomedical Engineering (RBME). He is a Distinguished Lecturer of the IEEE Sensors Council from 2017 to 2022. He chairs the IEEE Sensors Council NSW chapter.
Prof. Hongtao Tang ，Hunan University, China
Experience:
Hongtao Tang Associate Professor/doctoral supervisor of Wuhan University of Technology, deputy director of the Department of Industrial Engineering. In recent years, he is mainly engaged in digital design, intelligent manufacturing, intelligent optimization and application in manufacturing industry (automotive, hydraulic cylinder, mold, casting and other industries); developed digital design software applicable to automotive, hydraulic cylinder, mold, casting and other industries, developed intelligent manufacturing PLM/ERP/MES industrial software, which has been applied in many companies in different industries and achieved great economic benefits. Received one second prize of Hubei Provincial Science and Technology Progress (ranked 2/10). He has presided over 2 national natural science funds and 2 youth funds, and more than 20 horizontal projects with a total funding of more than 8 million. He has published more than 60 academic papers, including more than 20 SCI papers, one English monograph, 19 soft books, and 13 invention patents. He is a reviewer of more than 30 international journals such as IEEE, IJPR, JCLP, CAIE, JIM, ASOC, COR, etc. He has been awarded excellent paper award 4 times and Kenote speaker report 5 times. He is a reviewer of industrial intelligent transformation, industrial internet and digital economy for Wuhan Municipal Bureau of Economic and Information Technology.
Technical Program Committees
Dr. Jahariah Sampe from UKM, Malaysia.
Dr. Mohammad Faseehuddin from Faculty of Engineering, Symbiosis International University (SIU), Pune, Maharashtra, India.
Dr. Lee Hwang Sheng from Universiti Tunku Abdul Rahman (UTAR), Malaysia.
A. Prof. MRUTYUNJAY MAHARANA from Xi'an Jiaotong University, China.
Dr. Tirupati S from Universiti Tenaga Nasional Malaysia.
Topics
| Mechatronics | Electronics |
| Microfabrication Theory | Computer Architecture |
| Mechanical Measurement, Control and Automation | Microelectronic System |
| Bio-mechatronics | Analog Integrated Circuit Design |
| Fluid Drive and Control Technology | Mixed-signal Integrated Circuit Design |
| Artificial Intelligence | Man-machine Interaction System |
| Electromechanical and Composite Drives | Electronic Material |
| Drive Train Dynamics | Control and Computer Systems |
| Vehicle Power Transmission and Control | Nonlinear Random Control |
| Drive Train Manufacturing Process | Process Optimization and Scheduling |
| CNC Machine tool Reliability Technology Research | Control and Intelligent Systems |
| MEMS Dynamics | Artificial Intelligence Expert System |
| Rigid-flex Coupling Dynamics | Fuzzy Logic and Neural Networks |
| Mechanical Design, Manufacturing and Automation | Optimal, Robust and Adaptive Control |
| Mechanical System Dynamics and Control | Telecommunications Engineering |
| Flexible Cellular Mechanism Dynamics | Embedded System |
| Optoelectronics Integrated Manufacturing and Intelligence | Wireless and Mobile Communications |
| Vibration, Shock and Noise Theory, Application and Control | Communications Electronics and Microwave |
| Micromachining Platform | Distributed Platform (computing) |
| Digital Prototyping and Virtual Reality | Communications Networks and Systems |
| Manufacturing Systems and Manufacturing Quality Control | Telematics Services |
| Nonlinear Vibration, Modal Analysis and Parameter Recognition | Radio Communications |
| Active, Passive and Intelligent Control of Vibration, Shock and Noise | Real-time Imaging and Video Processing |
| Vibration and Control of Rotating Machinery | CMOS Image Sensor |
| Automotive Dynamics and Intelligent Suspension Systems | Imaging System Design and Instrumentation |
| High-Precision, high-acceleration Motion Systems and Controls | Computer Engineering |
| Numerical Design Theory and Simulation | Communication Modulation and Signal Processing |
| Modern Signal Processing, Information Fusion and Data Mining | Parallel Distributed Computers |
| Manufacturing Process Simulation and Quality Control | Electromagnetic Compatibility |
| Mechanical Drives and Systems Measurement and Control | High Voltage Insulation Technology |
| Design Theory and Methods for Complex Electromechanical Products | Human-computer Interaction |
| Machining, Forming Theory and Process Control | Virtual/Augmented Reality |
| Condition Monitoring, Fault Diagnosis and Intelligent Maintenance Systems | VLSI Design - Network Traffic Modeling |
| Signal Processing and Intelligent Maintenance of Mechanical Systems | Performance Modeling |
| Fault Diagnosis and Intelligent Maintenance of Machinery and Equipment | Electric Motors and Appliances |
| Modeling Complex Product Assemblies and Diagnosing Error Sources | Bio-signal Processing |
| Design and Implementation of Application Specific Integrated Circuits (ASICs) | Reliable Calculations and High Performance Computing |
Topics include but are not limited to the following areas
Submission
1. The submitted papers must not be previously published or under consideration of publication elsewhere.
2. Please submit your full paper (Word+pdf) to Oversea Authors: English SUBMISSION SYSTEM
3. And please submit the full paper if both the presentation and publication are needed.
4. Please submit the Abstract only if you just want to make a presentation.
5. Templates download:
6. Should you have any questions or you need any information in English, please contact us at icamce2023@163.com
Note:
1) The author can make an Oral Presentation or Poster Presentation after the Abstract is accepted and the payment is made.
2) All submitted articles should report original research results, experimental or theoretical, not previously published or under consideration for publication elsewhere. Articles submitted to the conference should meet these criteria. We firmly believe that ethical conduct is the most essential virtue of any academics. Hence, any act of plagiarism or other misconduct is totally unacceptable and cannot be tolerated.
Program
| Program | ||
| July 28 | 13:00-17:00 | Registration |
| July 29 | 09:00-12:00 | Speeches of Keynote Speakers |
| 12:00-14:00 | Lunch | |
| 10:00-10:20 | Oral Presentations | |
| 18:00-19:30 | Banquet | |
| July 30 | 09:00-18:00 | Academic Investigation |
Registration
| Items | Registration Fee |
| Regular Registration(4 -6 pages) | 490 USD/ paper (6 pages) 3400 CNY/ paper (6 pages) |
| Student Registration | 440 USD/ paper (6 pages) 3000 CNY/ paper (6 pages) |
| Extra Pages (Begin at Page 7) | 50 USD/ extra page 300 CNY/ extra page |
| Attendees without a Submission | 180 USD/ person 1200 CNY/ person |
| Attendees without a Submission (Groups） | 150 USD/ person（≥ 3 person） 1000 CNY/ person（≥ 3 person） |
| Purchase Extra Proceedings/Journal copies | 75 USD/ book 500 CNY/ book |
VISA/MasterCard/Paypal
Details of the attending registration
Join as a Presenter: If you are only interested in giving a presentation at the conference without publishing your paper in the proceedings, you can choose to attend ISMSEE 2023 as a Presenter. As a presenter, you need to submit the Abstract and Title of your presentation during the registration. For further information, please contact us at:
icamce2023@163.com
Join as a Listener: ISMSEE 2023 is an unmissable conference. It is a good chance and an effective platform for you to meet many renowned experts and researchers in the field of the latest academic research. You are welcome to attend this great event. You just need to complete the registration as a Listener before the registration deadline.
Contact
Conference Secretary: Serena Lu
E-mail: icamce2023@163.com
Tel: +86-139 2215 1347 (WeChat)
QQ: 564573170
