CONFERENCE INFORMATION:
Website：www.se-cmp.net
Conference Date: July 21-23, 2023
Venue: Zhengzhou, China
Submission Deadline: Mar. 20, 2023
Indexing: EI, Scopus
Consulting email: contact_secmp@163.com
Infomation
2023 2nd International Conference on Semiconductors, Electromagnetics and Condensed Matter Physics (SECMP 2023) will be held from July 21 to 23 in Zhengzhou, China. It dedicates to creating a platform for academic communications between specialists and scholars in the fields of Semiconductors, Electromagnetics and Condensed Matter Physics.
SECMP 2023 is the Semiconductors, Electromagnetics and Condensed Matter Physics conference aimed at presenting current research being carried out. The idea of the conference is for the scientists, scholars, engineers, and students from Universities all around the world and the industry to present ongoing research activities, and hence to foster research relations between the Universities and the industry. This conference provides opportunities for the delegates to exchange new ideas and application experiences face to face, establish business or research relations, and find global partners for future collaboration.
We cordially invite you to submit the paper and attend SECMP 2023. Looking forward to your participation!
Keynote Speaker
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CALL FOR PAPER
The topics of interest for submission include, but are not limited to:
| Semiconductor | Electromagnetism | Condensed Matter Physics |
Semiconductor Spin Physics and Topological Phenomena Semiconductor Nano and Devices wide/narrow bandgap semiconductor Compound semiconductor magnetic semiconductor organic semiconductor Optoelectronic and Photovoltaic Devices semiconductor physics semiconductor quantum computing Microwave Photonic Device Physics Semiconductor materials and device reliability Semiconductor Manufacturing and Application Emerging Semiconductor Technologies Advanced Photoresist | Electromagnetic Theory Electromagnetic Education Electromagnetic field calculation Electromagnetic measurement Electromagnetic packaging Electromagnetic modeling of devices and circuits the electromagnetic properties of the material, EMC/EMI/Electromagnetic Pulse inverse scattering Super material Phased Array and Adaptive Array Printed and Conformal Antennas Radar Cross Section and Asymptotic Technique Stochastic and Nonlinear Electromagnetics reflector antenna biomagnetism Brain Oscillations and Network Connections magnetoencephalography | Unconventional Superconducting Topological Quantum Systems statistical physics quantum phase quantum simulation nano magnetic nanomaterials Nanophysics and Technology New Energy Materials Strongly Correlated Systems and Machine Learning Solid State Quantum Information and Computing Twisted bilayer and multilayer graphene systems Low-dimensional and artificial microstructure physics Multiferroics and Quantum Magnetic Topology Computational Condensed Matter Physics and Its Applications Soft Condensed Matter Physics and Its Interdisciplinary Sciences quantum artificial intelligence |
Publication
1. All accepted full papers will be published in conference proceedings and will be submitted to EI Compendex / Scopus for indexing.
*paper template（Download), No less than 4 pages.
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◆Submission Methods
1.The submitted papers must not be under consideration elsewhere.
2.Please send the full paper(word+pdf) to SUBMISSION SYSTEM
3.Please submit the full paper, if presentation and publication are both needed.
4.Please submit the abstract only, if you just want to make presentations.
Agenda of SECMP 2023
2023 2nd International Conference on Semiconductors, Electromagnetics and Condensed Matter Physics (SECMP 2023) will be held on July 21-23, 2023 in Zhengzhou, China. The following information about the schedule is for your reference:
| Schedule | ||
| July 21 | 13:00-17:00 | Registration |
| 18:00-19:30 | Dinner Party | |
| July 22 | 09:00-12:00 | Speeches of Keynote Speakers |
| 12:00-14:00 | Lunch | |
| 14:00-18:30 | Oral Presentations | |
| 18:00-19:30 | Banquet | |
| July 23 | 09:00-18:00 | Academic Investigation |
For the publication on conference proceedings:
| Item | Registration fee |
| Regular Registration for Paper (4 pages) | 500 USD/per paper (4 pages) 3400 CNY/per paper (4 pages) |
| Manuscript numbers ≥ 3 | 450 USD/ per paper (4 pages) 3100 CNY/per paper (4 pages) |
| Extra Pages (Begin at Page 5) | 50 USD/ per extra page 300 CNY/per extra page |
| Attendees without Submission | 180 USD/per person 1200 CNY/per person |
| Attendees without Submission (Groups） | 150 USD/per person（≥ 3 person） 1000 CNY/per person（≥ 3 person） |
| Purchase Extra Journal | 75 USD/book 500 CNY/book |
CONTACT US
Conference Secretary: Carol Dong
E-mail: contact_secmp@163.com
Tel: +86-17737319063 (Wechat)
QQ: 246861590
