2022 3rd IEEE International Conference on Intelligent Design (IEEE-ICID 2022)
October 21-23, 2022 Xi'an, China
◆ Important Information
Conference Website: www.ic-id.org
Start Date/End Date: October 21-23, 2022
Venue: Xi'an, China
Submission Deadline: September 30, 2022
Indexing: EI, Scopus, SCI
◆ About the Conference
2022 3rd International Conference on Intelligent Design (ICID 2022) is organized by Silk Road Innovation Industry Alliance, Management Committee of Xi' an Beilin University-based Innovation Industrial District and Xi'an Design Union, supported by Xi'an Science and Technology Bureau. ICID 2022 will be held on October 21-23, 2022 in Xi'an, China.
ICID 2022 is to bring together innovative academics and industrial experts in the field of electromechanical, industry, environment, architecture, computer and intelligent design to a common forum.
We warmly welcome all universities, academic units and research enterprises to actively participate in and mobilize academic talents at home and abroad to participate in the ICID 2022 based on their actual needs. Relevant professionals to contribute and participate in the meeting, share in the industry leading technology and research achievements, promote academic exchanges, explore cooperation space, promote intelligent design to the digital, networked, intelligent design, green development path, in order to promote the world economy innovation, dynamic, interactive, make greater contribution to growth.
ICID 2022 is now been included in the IEEE Conference List!
◆ Organizer
◆ Conference Chair
Prof. Changde Lu
Northwestern Polytechnical University
◆ Publication
Ⅰ. Submit to Conference Proceedings (EI)
All accepted full papers will be published by IEEE and will be submitted to IEEE Xplore, EI Compendex, Scopus for indexing.
Submission Methods
Submission Deadline: September 30, 2022
1.The submitted papers must not be under consideration elsewhere.
2.Please send the full paper(word+pdf) to contact@ic-id.org
3.Please submit the full paper, if presentation and publication are both needed.
4.Please submit the abstract only, if you just want to make presentation.
5.Should you have any questions, or you need any materials in English, please contact us at contact@ic-id.org or Carol Wen: +86-17620001794 (Tel/WeChat).
Ⅱ. Submit to SCI journals
1. Advances in Mechanical Engineering (ISSN: 1687-8132, IF=1.616, Special Issue)
2. Journal of Imaging Science and Technology (ISSN: 1062-3701, IF=0.379, Special Issue)
3. International Journal of Distributed Sensor Networks (ISSN: 1550-1477, IF= 1.151, Special Issue)
4. IEEE Sensors Journal (ISSN: 1530-437X, IF= 3.073, Regular Issue)
◆ Call For Papers
Topics:
1. Intelligent Electromechanical Design
2. Intelligent Industrial Design
3. Intelligent Environmental Design
4. Intelligent Architectural Design
5. Digital Design
6. Computer Technology
7. Innovative Design
More detailed topics, please visit: http://www.ic-id.org/call_for_paper
◆ Registration
For the Publication on Conference Proceedings:
| Item | Registration fee (By CNY) | Registration fee (By US Dollar) |
| Regular Registration for Paper | 3200 CNY/paper (4-6 pages) | 500 USD/paper (4-6 pages) |
Paper numbers ≥ 3 | 2900 CNY/paper (4-6 pages) | 450 USD/paper (4-6 pages) |
| Extra Pages (Begin at Page 7) | 300 CNY/extra page | 50 USD/extra page |
| Attendees without Submission | 1200 CNY/person | 180 USD/person |
| Attendees without Submission (Groups) | 1000 CNY/person（≥ 3 people） | 150 USD/person（≥ 3 people） |
◆ Contact Us
Conference Secretary: Carol Wen
E-mail: contact@ic-id.org
Tel:（+86）17620001794
WeChat: 17620001794
QQ: 3572241095
