2023 2nd  International Conference on Simulation Design and Computational Modeling(SDCM2023)

All papers will be reviewed by two or three expert reviewers from the conference committees. After a careful reviewing process, all accepted papers  will be published in the Conference Proceedings, and submitted to EI Compendex, Scopus for indexing.

Important  informations

Conference Website：www.icsdcm.org

Conference Dates: April 28-30,2023

Conference Venue: Hangzhou· China

Full Paper Submission Date: February 28，2023

Notification of Acceptance Date: Within one week of submission

Index：EI-Compendex、Scopus

About SDCM2023

As one of the branch venues,2022 8th International Conference on Mechanical Engineering, Materials and Automation Technology -- Simulation Design and Computational Modeling (MMEAT-SDCM2022) was successfully taken place on May 27-29, 2022 in Qingdao, China. 2023 2nd  International Conference on Simulation Design and Computational Modeling(SDCM2023) will be held in Hangzhou, China, from April 28 to 30, 2023.

SDCM2023 is to bring together innovative academics and industrial experts in the field of simulation design and computational modeling to a common forum. This conference also promotes the establishing of business or research relations among global partners for future collaboration. We hope that this conference could make significant contribution to the update of knowledge about these latest scientific field. 

About Green's Function Seminar

Organizer

 Dalian University of Technology

Supported By：

AEIC Academic Exchange Information Center

 Committee

 Keynote Speaker

Prof . Chen Zhikui

Dalian University of technology,China                 

Prof. Sailesh Iyer

CSE/IT Department, Rai School of Engineering,India

Assoc. Prof  BO JIAO

School of Information Science & Technology, Tan Kah Kee Colleage,Xiamen University, China

Assoc. Prof. Ir Dr AZLI ABD RAZAK

School of Mechanical Engineering, College of Engineering, Universiti Teknologi MARA，Malaysia

Speech Title: Numerical Analysis of Mixing Ventilation Reduced-Scale Inside Aircraft Cabin

 Organizing Committees

A. Prof. Rongyun Zhang, Anhui Polytechnic University, China

Dr. Yongmao Xiao, Xinyang Normal  University, China

Dr. Shichang Xiao, Shanghai Maritime University, China

Dr. Anand Vyas, Department of Mechanical Engineering, Hong Kong, China

Dr. Liang Zhang，Jiangsu Normal University, China

Prof. Tao Yu, Tongji University, China

Prof. Sirong Yu，China University of Petroleum, China

Prof. Zhu Weibing, Xihua University, China

 Technical Program Committees

A. Prof. Wang Rongjie, Marine Engineering Institute of Jimei University, China

A. Prof. Gang Li, University of Maryland Baltimore County, USA

A. Pro. Mohd Fadzli Bin Abdollah, Universiti Teknikal Malaysia Melaka, Malaysia

A. Prof. Xiucheng LIU, Beijing University of Technology, China

A. Prof. Mamoun FELLAH, Khenchela University, Algeria 

A. Prof. M. Deniz Turan, Firat University, Turkey

A. Prof. Muhammad Majid Gulzar, University of Central Punjab, Pakistan

Assistant Prof. Sajid Iqbal, University of Engineering and Technology (UET) Lahore, Pakistan

Dr. Kuan Yew Wong, Universiti Teknologi Malaysia, Malaysia

Dr. Lee Hwang Sheng，UniversitiTunkuAbdulRahman(UTAR)，MALAYSIA

Dr. Dan Xue, Shenyang University of Technology, China

Dr. Ran Zhao, Jiangxi Province Key Laboratory of Precision Drive & Control, China

Dr. Mukuna Patrick Mubiayi, University of Johannesburg, South Africa 

Dr.Shuping Dang, University of Oxford, UK

Dr. Mohamed Kamal Ahmed Ali (M.K.A. Ali), Wuhan University of Technology, Egypt

Prof. Hazizan Md Akil, Universiti Sains Malaysia, Malaysia

Prof. Nan-Chyuan Tsai, National Cheng Kung University, China

Prof. Ir. Dr. Ts. Abdul Talib bin Din, Universiti Teknikal Malaysia Melaka，Malaysia

Prof. Ziad Moumni，ENSTA ParisTech，France

Prof. Zhou Chunjiang, Zhejiang Institute of Mechanical and Electrical Engineering, China 

Prof. Anhui Liang, Guangdong University of Technology(GDUT), China

 Topics 

Topics  of interest for submission include, but are not limited to:

 Submission

Submission Methods

1.The submitted papers must not be under consideration elsewhere.

2.Please send the full paper(word+pdf) to SUBMISSION SYSTEM

3.Please submit the full paper, if presentation and publication are both needed.

4.Please submit the abstract only, if you just want to make presentations.

5.Templates Download: Templates

6.Should you have any questions, or you need any materials in English, please contact us.

Note: 

1)Both Abstract and Full Paper are welcomed. The author can make an oral presentation after the Abstract is accepted and the payment is finished.

2)All submitted articles should report original, previously unpublished research results, experimental or theoretical. Articles submitted to the conference should meet these criteria and must not be under consideration for publication elsewhere. We firmly believe that ethical conduct is the most essential virtual of any academic. Hence any act of plagiarism is a totally unacceptable academic misconduct and cannot be tolerated.

 Registration

From January 1, 2023:

Details of the attending registration

Join as Presenter: If you are interested in giving presentation on conference, without publishing your paper in the proceeding, you can choose to attend SDCM 2023 as a Presenter. As presenter, you need to submit the abstract and title of your presentation before register. For further information, please contact us.

Join as Listener: SDCM 2023 is an unmissable conference. It is a good chance and an effective platform to meet many renowned experts and researchers in the filed of latest academic research. You are welcome to attend this great event. You need to complete the registration as Listener before the registration deadline.

Program

Contact us

Conference Secretary:  Serena Lu

E-mail: icsdcm@163.com 

Tel: +86-139 2215 1347 (Wechat)

QQ: 564573170