2026 International Conference on Materials Science and Intelligent Computing(MSIC 2026)
About MSIC 2026
Conference Websites:www.ic-msic.com
Conference Dates: November 6-8,2026
Conference Venue: Beijing, China
Indexed by: EI Compendex, Scopus
The 2026 International Conference on Materials Science and Intelligent Computing ( MSIC 2026 ) will be held in Beijing from November 6 to 8, 2026. As an international academic exchange platform with important influence in the field of materials science and intelligent computing, MSIC2026 aims to bring together top experts and scholars from universities, scientific research institutions and enterprises around the world to share the latest research progress and innovative technologies, and promote the deep integration and cross-border cooperation of related disciplines.
This conference focuses on the two core areas of ' material science ' and ' intelligent computing ', focusing on cutting-edge hotspots and application breakthroughs, and promoting the close integration of theoretical innovation and engineering practice. MSIC 2026 not only builds a high-quality academic exchange and cooperation platform for participants, but also provides a broad stage for displaying the latest scientific research results and technology applications, helping to promote the innovative development of materials science and intelligent computing technology.
We sincerely invite experts and scholars to actively participate in the conference and contribute to the event, jointly promote the academic exchange and technological progress in the field of material science and intelligent computing, and create a better scientific research future.
We are pleased to invite you to submit an abstract/manuscripts to present your work in this important scientific event. Previous proceedings were both indexed by EI Compendex and Scopus.
Call For Paper
The topics of interest for submission include, but are not limited to:
Track 1 : Advanced material design and characterization Material Synthesis and Process Innovation Nanomaterials and Nanostructure Design Functional Materials and Smart Materials High performance composite materials Relationship between microstructure and properties of materials Accelerated material testing and life prediction New energy materials and energy storage technology Material characterization technology and instrument development Green materials and sustainable manufacturing Failure mechanism and reliability analysis of materials | Track 2 : Intelligent Computing and Material Simulation Material Big Data and Machine Learning Applications Computational Materials Science and Multiscale Modeling Artificial intelligence auxiliary material design High-throughput computing and automation experiments Intelligent optimization algorithm and material screening Multi-physics simulation and numerical analysis Data-driven material performance prediction Modeling of material structure-property relationship Intelligent experimental design and online monitoring Digital twin technology of material process |
Track 3 : Material preparation automation and intelligent manufacturing Material preparation automation technology Intelligent manufacturing system and digital factory Additive manufacturing and 3D printing materials Process monitoring and control technology Intelligent sensing and process optimization High precision manufacturing and surface engineering Application of intelligent robot in material processing Green manufacturing and resource saving technology Industrial Internet and manufacturing data analysis Artificial intelligence technology in material manufacturing | Track 4 : Application Materials and Intelligent System Integration Smart Sensing Materials and Devices Flexible electronic materials and wearable technology Smart Structures and Self-Healing Materials Intelligentization of biomaterials and medical materials Functional Film and Coating Technology High temperature, high strength engineering materials Material system integration and multi-functionalization Applications of smart materials in the fields of energy and environment New Electronic and Optoelectronic Materials l On-line detection and intelligent diagnosis of material properties |
Publication
All papers submitted to MSIC 2026 will be reviewed by two or three expert reviewers from the conference committees. After a rigorous reviewing process, all accepted papers will be published in the Conference Proceedings and submitted to EI Compendex and Scopus for indexing.
Program
Schedule | ||
November 6, 2026 | 14:00-17:00 | Conference Registration & Materials Collection |
November 7, 2026 | 08:30-09:00 | Pre-conference Registration & Check-in |
09:00-12:00 | Keynote Speeches | |
12:00-14:00 | Lunch | |
14:00-17:00 | Oral Presentations | |
17:00-17:30 | Conference Closing | |
17:30-19:30 | Banquet | |
November 8, 2026 | 09:00-12:00 | Academic Visit |
Note: A more detailed programme will be emailed to registered participants after the registration deadline. Actual time arrangement may be adjusted slightly according to the number of participants.
Submission Methods
1. The submitted papers must not be previously published or under consideration of publication elsewhere.
2. Please submit your full paper (Word+pdf) to SUBMISSION SYSTEM
▶Oversea submission: Click here
▶Domestic submission: Click here
3. And please submit the full paper if both the presentation and publication are needed.
4. Please submit the Abstract only if you just want to make a presentation.
5. Templates download: Templates
6. Should you have any questions or you need any information in English, please contact us
Registration Fee
| Items | Registration Fee |
| Regular Registration for Paper (4-6pages) | 540 USD/ paper (6 pages) 3600 CNY/ paper (6 pages) |
| Extra Pages (Begin at Page7) | 60 USD/ extra page 400 CNY/ extra pag |
| Attendees without a Submission | 180 USD/ person 1200 CNY/ person |
| Attendees without a Submission (Groups） | 150 USD/ person（≥ 3 person） 1000 CNY/ person（≥ 3 person） |
| Purchase Extra Proceedings/Journal copies | 75 USD/book 500 CNY/book |
* If your paper is accepted by committee and you registered for the conference, a 30% processing fee will be deducted if a retraction is requested.
Contact us
Conference Secretary:Miss.Ye
E-Mail: yeziqi@ais.cn
Tel: +86-19120688609 (WeChat)
Conference Secretary Consultation
