2022 2nd International Conference on International Conference on Advanced Materials and Mechatronics——Semiconductors and Electronics, Circuits(SEC 2022)
June 17-19, 2022 | Dali · China
Conference Website: www.ic-sec.org/
Paper Submission Deadline: June 13, 2022
Conference Date: June 17-19, 2022
Notification of Acceptance: Within one week of submission
▶SEC 2022
| June 17-19 , 2022 丨Dali
2022 2nd International Conference on International Conference on Advanced Materials and Mechatronics——Semiconductors and Electronics, Circuits(SEC 2022).SEC 2022 provides an enabling platform for innovative academics, engineers and industrial experts in the field of Semiconductors,and Electronics, Circuits to exchange new ideas and present research results.This conference also promotes the establishing of business or research relations among global partners for future collaboration. We hope that this conference could make significant contribution to the update of knowledge about these latest scientific field.
We sincerely invite you to participate in SEC 2022 and look forward to seeing you in Dali!
▶Publication
All papers will be reviewed by two or three experts from the committees. After a careful reviewing process, all accepted papers will be published in conference proceeding , and submitted to EI Compendex, Scopus for indexing.
▶Call For Paper
Electronic Information Engineering
Circuit Analysis and Design
Electronic Packaging Technology
Microelectronics Science and Engineering
Electronics and Nanoelectronics
Advanced Electromagnetics
communication electronic circuit
Integrated circuit design and systems integration
Microwave Photonic Device Physics
Electronic Information Engineering
Integrated optics
Micro/Nano Systems and Networks
digital signal processin
Semiconductors | Electronic Technology | Circuits |
Semiconductor spin physics and topological phenomena Semiconductor nanometers and devices Wide/narrow band gap semiconductor Compound semiconductor Magnetic semiconductor Organic semiconductor Photoelectric and photovoltaic devices Semiconductor physics Semiconductor quantum computing Microwave photonic device physics Semiconductor materials and device reliability Semiconductor manufacturing and application Emerging semiconductor technology | Electronic Information Engineering Circuit Analysis and Design Electronic Packaging Technology Microelectronics Science and Engineering Electronics and Nanoelectronics Advanced Electromagnetics communication electronic circuit Integrated circuit design and systems integration Microwave Photonic Device Physics Electronic Information Engineering Integrated optics Micro/Nano Systems and Networks digital signal processing | Analog Circuits and Signal Processing Bioengineering Circuits and Systems Biomedical Circuits and Systems Circuit & System Design Circuits and Systems for Communications Circuit Simulation & Modeling Compound Semiconductor Devices and Circuits Digital Circuits and Signal Processing Device Simulation & Modeling Digital Communications Emerging Technologies (Nano, MEMS) Electronic Design Automation Methodologies Harvesting/Scavenging Energy Circuits Integrated Circuit and System Design Low-Power and Harvesting Techniques Low-Power, RF Devices & Circuits Linear & Nonlinear Circuits and Systems Multimedia Systems and Signal Processing Neural Network Circuits and Systems Nanoelectronic Circuits and Nanoarchitectures Nano-Electronics/Fabrication/Structures Photonic and Optoelectronic Circuits Power and Energy Circuits and Systems Power Electronics and Applications RF and Wireless Circuits and Systems Sensing and Sensor Networks Test and Reliability VLSI Systems, Applications and Computer Aided Network Design |
▶Registration
Items | Registration Fee |
Regular Registration for Paper (4 pages) | 500 USD/per paper (4 pages) 3200 CNY/per paper (4 pages) |
Manuscript numbers ≥ 3 | 450 USD/ per paper (4 pages) 2900 CNY/per paper (4 pages) |
Extra Pages (Begin at Page 7) | 50 USD/ per extra page 300 CNY/per extra pag |
Attendees without Submission | 180 USD/per person 1200 CNY/per person |
Attendees without Submission (Groups) | 150 USD/per person(≥ 3 person) 1000 CNY/per person(≥ 3 person) |
Purchase Extra Journal | 75 USD/book 500 CNY/book |
▶Contact US
Conference Secretary: Chelsea Ye
E-mail: yezijun@ais.cn
Tel: +86-18122478740 (WeChat)