2023 5th International Conference on Electronic Engineering and Informatics (EEI 2023)

2023 5^th International Conference on Electronic Engineering and Informatics (EEI 2023)

※ Important Information ※

Place: June 23-25, 2023, Wuhan, China

Submission Deadline: March 15, 2023

Notice of Acceptance/Rejection: within one week after

Submission Retrieval: Ei Compendex, Scopus

※ Introduction ※

The 2023 5^th International Conference on Electronic Engineering and Informatics (EEI 2023) will be held on June 23-25, 2023 in Wuhan, China. EEI 2023 is to bring together innovative academics and industrial experts in the field of Electronic Engineering and Informatics to a common forum. The primary goal of the conference is to promote research and developmental activities in Electronic Engineering and Informatics, and another goal is to promote scientific information interchange between researchers, developers, engineers, students, and practitioners working all around the world. The conference will be held every year to make it an ideal platform for people to share views and experiences in Electronic Engineering and Informatics and related areas.

※ The conference is soliciting state-of-the-art research papers in the following areas of interest but not limited to:

Topic 1: Electronic Technology

3D process and integration technology
Substrate embedding and advanced flip chip packaging
MEMS and sensor technology
Wafer-level CSP and heterogeneous integration
Design and Analysis of Transmission System
New materials, equipment and 3D interconnection
Wearable, flexible and stretchable electronics
Optical interconnection and 3D photonics
Digital system and logic design
Computer architecture and VLSI
Network-driven multi-core chip
Advanced robotic system
Motor
Analog and digital electronics
Signals and Systems

Topic 2: Information and Communication

Electronic equipment
Satellite and Space Communications
Network and Information Security
Signal processing for wireless communication
Cognitive Radio and Software Radio
Optical networks and systems
Electromagnetic field theory
Antenna, propagation and transmission technology
Optical communication
Radar signal and data processing

专题1：电子技术

3D流程和集成技术
基板嵌入和先进的倒装芯片封装
MEMS和传感器技术
晶圆级CSP和异构集成
输电系统的设计与分析
新型材料，设备和3D互连
可穿戴，灵活和可伸展的电子产品
光学互连和3D光子学
数字系统与逻辑设计
计算机体系结构和VLSI
网络驱动的多核芯片
先进的机器人系统
电机
模拟和数字电子
信号与系统

专题2：信息和通信

电子设备
卫星与太空通讯
网络与信息安全
无线通信的信号处理
认知无线电和软件无线电
光网络和系统
电磁场理论
天线，传播和传输技术
光通讯
雷达信号与数据处理

※ Publication ※

All accepted full papers will be published in the conference proceedings and will be submitted to EI Compendex / Scopus for indexing.

※ Registration ※

For the publication on conference proceedings:

Items	Registration Fee
Regular Registration for Paper (4 pages)	550 USD/ paper (4 pages) 3800 CNY/ paper (4 pages)
student Registration ≥ 3	500 USD/ paper (4 pages) 3400 CNY/ paper (4 pages)
Extra Pages (Begin at Page 5)	60 USD/ extra page 400 CNY/ extra pag
Attendees without Submission	180 USD/ person 1200 CNY/ person
Attendees without Submission (Groups）	150 USD/ person（≥ 3 person） 1000 CNY/ person（≥ 3 person）
Purchase Extra Journal	75 USD/book 500 CNY/book

※ Contact Us ※

Conference Secretary: Yasmin

Tel: +86-13502443374 (Wechat)

QQ: 779188085

E-mail: ico_eei@163.com

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