2024 7^th International Conference on Advanced Electronic Materials, Computers and Software Engineering (AEMCSE 2024)

-Important information

Conference date: May 10-12, 2024.

Conference Venue: Nanchang, China

Conference website: http://www.aemcse.org

-Introduction

The 2024 7th International Conference on Advanced Electronic Materials, Computers and Software Engineering (AEMCSE 2024) will be held in Nanchang, China on May 10-12, 2024. AEMCSE is proud to host a global gathering of theorists and experts in Advanced Electronic Materials, Computers and Software Engineering in the highly complex field of knowledge and software engineering, which brings researchers, practitioners, and scientists in discussion of the latest methods, research developments, and future opportunities. This event will include the participation of renowned keynote speakers, oral presentations, posters sessions and so on.

If you do not need to publish any paper, you may attend our conference as oral/poster presenter, or listener. AEMCSE 2024 welcomes submission of researches concerning any branch of Advanced Electronic Materials, Computers and Software Engineering.

-Sponsored by

-Organized by

-Co-organized by

-Committee

Conference General Chair

Prof. Xiaolin Qiu, Nanchang Institute of Technology, China

邱小林（理事长），南昌理工学院

Prof. Wenjun Tan, Northeastern University, China

覃文军（副院长/教授），东北大学

Technical Program Committee Chair

Prof. Guandong Xu, University of Technology Sydney, Australia

徐贯东（教授），澳大利亚悉尼科技大学

Organizing Committee Chair

Prof. YanbinFan, Nanchang Institute of Technology, China

范彦斌（校长/教授），南昌理工学院

Publication Chair

Prof. Lvqing Yang, Xiamen University, China

杨律青（教授），厦门大学

-Call For Papers

-计算机工程 (Computer Engineering)：

微处理器和微控制器设计 (Microprocessor and Microcontroller Design)

计算机系统集成 (Computer System Integration)

FPGA和ASIC设计 (FPGA and ASIC Design)

计算机网络安全技术 (Computer Network Security Technologies)

嵌入式系统 (Embedded Systems)

计算机工程 (Computer Engineering)

微处理器和微控制器设计 (Microprocessor and Microcontroller Design)

计算机系统集成 (Computer System Integration)

FPGA和ASIC设计 (FPGA and ASIC Design)

计算机网络安全技术 (Computer Network Security Technologies)

嵌入式系统 (Embedded Systems)

-软件工程 (Software Engineering)

软件开发生命周期 (Software Development Lifecycle)

敏捷与DevOps实践 (Agile and DevOps Practices)

云计算服务与架构 (Cloud Computing Services and Architecture)

人工智能在软件开发中的应用 (Artificial Intelligence in Software Development)

软件项目管理与质量保证 (Software Project Management and Quality Assurance)

-先进电子材料 (Advanced Electronic Materials)

高频电子材料 (High-frequency Electronic Materials)

半导体材料与器件 (Semiconductor Materials and Devices)

电子封装材料 (Electronic Packaging Materials)

纳米电子材料 (Nano-electronic Materials)

柔性电子材料 (Flexible Electronic Materials)

-Publication

All accepted full papers will be published in SPIE - The International Society for Optical Engineering (ISSN: 0277-786X) and will be submitted to EI Compendex / Scopus  for indexing.

-Submission

 You can submit your paper (word+pdf) via Electronic Submission System：

Oversea Author Submission: https://paper-sub.com/login?url=/paper/FMV6JN

中国大陆作者投稿通道：https://www.ais.cn/attendees/paperSubmit/FMV6JN

Paper Requirements

1. Please follow the Manuscript template to write: 

http://www.aemcse.org/download

2.All submissions must not be less than 5 pages and not exceed 10 pages in length.

3.The article should be original writing that enhances the existing body of knowledge in the given subject area.

4.Results reported have not been submitted or published elsewhere .

5. Experiments, statistics, and other analyses are performed to a high technical standard and are described in sufficient detail.

6.Conclusions are presented in an appropriate fashion and are supported by the data.

7.The article is presented in an intelligible fashion and is written in Standard English.

8. Appropriate references to related prior published works must be included.

-Registration

-Contact

Ms. Kwok

Tel: +86-18124944750 (WeChat)

QQ：2152116918

E-Mail: AEMCSE@163.com