2023 7^th International Conference on Mechanics, Mathematics and Applied Physics (ICMMAP 2023)

September 8-10, 2023     Dalian, Liaoning, China

Important Information

Conference Website: www.icmmap.com

Date: September 8-10, 2023

Location: Dalian, Liaoning, China

1^st Submission Deadline: July 15, 2023

Submit to database: SCI, EI Compendex, Inspec, Scopus

Conference Introduction

Host: Dalian Jiaotong University

Supporters: School of Automation and Electrical Engineering & School of Science, Dalian Jiaotong University

Previous ICMMAP conferences have been held successfully. The history of the conference is as follows: 

The 1^st conference (ICMMAP 2017) was held on November 24-26, 2017 in Hohhot, Inner Mongolia, China. 

The 2^nd conference (ICMMAP 2018) was held on July 28-30, 2018 in Zhuhai, Guangdong, China. 

The 3^rd conference (ICMMAP 2019) was held on July 26-28, 2019 in Guilin, Guangxi, China. 

The 4^th conference (ICMMAP 2020) was held on July 17-19, 2020 in Lanzhou, Gansu, China (both online and offline). 

The 5^th conference (ICMMAP 2021) was held on July 23-25, 2021 in Nanjing, Jiangsu, China (both online and offline). 

The 6^th conference (ICMMAP 2022) was held on August 19-21, 2022 in Qingdao, Shandong, China (both online and offline). 

To exchange the latest progress in theory, technology and application in the field of mechanics, mathematics and applied physics in foreign countries in recent years and to show the latest achievements, 2023 7^th International Conference on Mechanics, Mathematics and Applied Physics (ICMMAP 2023) will be held in Dalian, Liaoning, on September 8-10, 2023. ICMMAP 2023 is hostd by Dalian Jiaotong University, supported by School of Computer and Communication Engineering and School of Science, Dalian Jiaotong University.

Call for Paper

Topics include but are not limited to the following areas:

1. Mechanics (Applied mechanics/analytical mechanics/computational mechanics/fluid mechanics/explosion mechanics/vibration/geomechanics/geodynamics/rotor dynamics/soil mechanics/plastic fracture and damage mechanics/force analysis/mechanics and mechanical production, etc.)

2. Mathematics (Data Analysis/Statistics and Bayesian Principle/Riemann Surface and Riemann Geometry/Preliminary Algebraic Topology/Parametric Computation/Statistical Analysis/Mathematical Modeling/Lie Groups and Representations/Linear Algebra/Matrices/Vector Analysis/Complex Variable Analysis/Differential Equations/Laplace Transforms/Fourier Analysis/Combinatorial Mathematics/Functional Theory/Discrete Mathematics, etc.)

3. Physics (Condensed matter physics and new materials/physics and applied physics/nuclear physics/acoustic/electrical/optical/thermal science/atomic physics/solid state physics/structure and physical properties/electrical and electronic technology/semiconductor physics/optoelectronics/optoelectronic technology and its applications/nuclear electronics/nuclear technology and applications/vibration/noise and its control/electroacoustic technology/circuit principles and analysis/quantum electronic informatics/optical quantum informatics/space science and technology, etc.)

4. Application Areas (Astronomy and Earth Sciences/Precision Agriculture/Aerospace/Automotive Industry/Chemical and Petroleum Engineering/Military and Defense/Construction Engineering and Project Management/Telecommunications Systems and Networks/Energy and Power Systems/Electronics Design and Manufacturing/Industrial Processes/Healthcare/Logistics/Traffic and Transportation/Robotics/Automation and Mechatronics/Hydraulic and Pneumatic Systems/Materials/Sports/Wireless Systems/Urban and Regional Planning and Engineering/GIS/GPS Systems, etc.)

More topics: www.icmmap.com/call_for_paper

Publication & Submission

1. Conferece Proceedings

1^st Submission Deadline: July 15, 2023

All accepted full papers will be published by conference proceedings and will be submitted to EI Compendex, Inspec, Scopus for indexing.

◆ The paper should be more than 5 pages.

◆ Template & Submission: Download

◆ Online Submission: paper-sub.com/paper/MA7J7N  or contact ic_mmap@163.com

2. SCI Journals

Journal 1: Science of Advanced Materials(ISSN :1947-2935, IF=1.067, CAS Q4) 

Journal 2: MATERIALS EXPRESS(ISSN :2158-5849, IF=1.65, CAS Q4) 

Journal 3: IET Image Processing(ISSN :1751-9659, IF=1.773, CAS Q4)

◆ Online Submission: www.ais.cn/sciPaperPro/contribute/147/1

◆ Invitation code: L162

Conference Program

2023 7^th International Conference on Mechanics, Mathematics and Applied Physics (ICMMAP 2023) will be held in Dalian, Liaoning, on September 8-10, 2023.

◆ Registration: www.ais.cn/attendees/index/MA7J7N

* The above program is a brief outline. A more detailed programme will be emailed to you after the registration deadline. The actual conference schedule may be a little different according to the number of participants.

Registration

* If your paper is accepted by committee and you registered for the conference, a 30% processing fee will be deducted if a retraction is requested.

Participation

1. Paper Authors: The edition fee includes a free place to attend the conference. The other authors can register as normal participant. All the authors can apply the presentation for free.

2. Keynote Speaker: Apply for the keynote speech on the conference. Please submit your personal CV, presentation title and abstract.

3. Oral Presenter: Apply for the oral presentation on the conference. Please submit your presentation title and abstract.

4. Poster Presentation: Apply for print the poster and the poster will be shown on the conference hall. Please submit the A1 vertical and electronic version.

5. Audience Participation: No submission but only participation.

◆ Registration:  www.ais.cn/attendees/index/MA7J7N

Contact Us

Conference Website: www.icmmap.com

E-mail: ic_mmap@163.com